DIP CABLE 14POS
DECI-CENTER JUMPERS 18POS
FLAT FLEX CABLE 7 POS 2" 26AWG
CONN IC DIP SOCKET 16POS TIN
CONN IC DIP SOCKET 26POS GOLD
CONN SOCKET SIP 37POS TIN
CONN SOCKET PGA ZIF GOLD
CONN IC DIP SOCKET ZIF 44POS
CONN IC DIP SOCKET 24POS GOLD
Bristol, PA – April 13, 2015 – Aries Electronics, a US manufacturer of standard, programmed and custom interconnection products, burn-in and test IC sockets, and adapters used worldwide, announced the introduction of its new thermal profiling solution for its test and burn-in socket line of products.
Aries' thermal profile solutions go beyond standard heat-sink and fan options offered by others. This solution incorporates advanced thermal profiling software to develop an application/IC specific thermal analysis for each customer's requirement(s).
This software will analyze all of the necessary parameters within the socket/IC/test environment and determine the correct heat sink/fan/cooling combination necessary to optimize the test and burn-in application. This enables the socket to be thermally correct before it is placed into its final environment saving Aries' customers time and money.
New thermal profiles are initiated using an online fill-in form linked from all of Aries' test and burn-in socket pages.
For additional information, contact Paul Ruo, Aries Electronics, Inc., 2609 Bartram Road, Bristol, PA 19007-6810 Tel 215-781-9956 Email: email@example.com