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Texas Instruments’ Al Griffin re-elected as TI Fellow

Texas Instruments Incorporated (TI) (NASDAQ:TXN) has re-elected Al Griffin, Ph.D., P.E. as a TI Fellow where he is responsible for problem solving and developing qualification solutions across TI’s worldwide manufacturing operations. Griffin was among seven innovators who received the prestigious title that recognizes those who fuel breakthrough and incremental technology innovation across the company, and support TI’s business goals

By Texas Instruments


DALLAS (January 26, 2016) – Texas Instruments Incorporated (TI) (NASDAQ:TXN) has re-elected Al Griffin, Ph.D., P.E. as a TI Fellow where he is  responsible for problem solving and developing qualification solutions across TI’s worldwide manufacturing operations. Griffin was among seven innovators who received the prestigious title that recognizes those who fuel breakthrough and incremental technology innovation across the company, and support TI’s business goals.

TI’s Fellows are elected by their peers and TI’s senior leadership team annually. Once elected, they must be re-elected every five years. This prestigious group of innovators represents fewer than one percent of TI’s total eligible engineering population. 

“Al is a respected and trusted leader that has a proven track record of providing innovative solutions for our customers” said Heather Hendershot, director of Quality Engineering Services for TI. “What an incredible honor for Al to be recognized in this way for his contributions.”

Dr. Griffin has more than 20 years of experience in metallurgy, materials science, materials reliability and materials integration, particularly with respect to semiconductor and printed circuit board manufacturing. Griffin is part of The Red Team in TI’s Semiconductor (SC) Quality organization where he works with the majority of TI’s top customers and collaborates across TI to solve customer problems and a wide range of worldwide TI wafer fab and assembly/test (A/T) issues.

Prior to his role in TI’s SC Quality organization, Griffin worked in the Silicon Technology Development organization on process engineering research and development. He also made significant yield and reliability improvements to several different process technology nodes for TI’s manufacturing organization.

Griffin joined TI in 1996 as a process engineer in TI’s Technology & Manufacturing Group. He was elected TI Fellow in June 2004 and has published on thin film deposition, corrosion, thermal conductivity and mechanical behavior. He also holds a variety of patents in the areas of process engineering and development.

Griffin holds a bachelor’s degree in Metallurgical Engineering from the University of Texas at El Paso and master’s and doctorate degrees in Materials Science from Rice University. He is currently on the Rice University Materials Science Advisory Board.