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DALLAS (January 26, 2015) – Texas Instruments (TI) (NASDAQ: TXN) has re-elected Sreenivasan “KK” Koduri as a TI Fellow where he is responsible for keeping TI ahead of the industry in technology. Koduri was among seven innovators who received the prestigious title that recognizes those who fuel breakthrough and incremental technology innovation across the company, and support TI’s business goals.
TI’s Fellows are elected by their peers and TI’s senior leadership team annually. Once elected, they must be re-elected every five years. This prestigious group of innovators represents fewer than one percent of TI’s total eligible engineering population.
"KK is an engineering leader who just changes the game in any activity he touches,” said Greg Hantak, vice president of Analog Design Systems for TI. “He looks for the solutions many of us can't even imagine are possible and drives to accomplish them."
For more than 20 years, Koduri has defined and driven the packaging strategy for TI’s Analog products. His innovations in wire-bonding, wafer-scale packaging, HotRod and embedded packaging have been adopted across TI and across the industry. Koduri also was instrumental in TI’s development of copper wire bonding technology, which surpassed two billion units shipped in 2014.
Koduri joined TI’s “Process Automation Center” in 1993 and today serves as technology lead on competitiveness in TI’s Analog business. He has received 47 U.S. patents and several international patents. Koduri is also a member of Southern Methodist University’s Electronics Engineering school board, where he helps develop staff and students.
Koduri has a bachelor’s, master’s and doctorate degrees in Electrical Engineering, a master’s degree in Business Administration and a master’s degree in Finance.