Part Number | SMDLTLFP500T3 |
---|---|
Part Status | Active |
Type | Solder Paste |
Melting Point | 281°F (138°C) |
Process | Lead Free |
Composition | Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
Flux Type | No-Clean |
Diameter | - |
Wire Gauge | - |
Core Size | - |
Form | Jar, 500g (17 oz) |
Shelf Life | 6 Months (Date of Manufacture) (Refrigerated) |
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