chip quik®, inc. is the manufacturer of the new patented chip quik® smd removal kit. this innovative method of removing smd's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
| Part Number | BGA0002 |
|---|---|
| Part Status | Active |
| Proto Board Type | SMD to PGA |
| Package Accepted | BGA |
| Number of Positions | 324 |
| Pitch | 0.031" (0.80mm) |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Material | FR4 Epoxy Glass |
| Size / Dimension | 2.700" x 3.000" (68.58mm x 76.20mm) |
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