chip quik®, inc. is the manufacturer of the new patented chip quik® smd removal kit. this innovative method of removing smd's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
| Part Number | BGA0009-S |
|---|---|
| Part Status | Active |
| Type | BGA |
| Number of Positions | 484 |
| Pitch | 0.050" (1.27mm) |
| Outer Dimension | 1.800" L x 2.600" W (45.72mm x 66.04mm) |
| Inner Dimension | - |
| Thermal Center Pad | - |
| Material | Stainless Steel |
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