chip quik®, inc. is the manufacturer of the new patented chip quik® smd removal kit. this innovative method of removing smd's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
| Part Number | BGA0012-S |
|---|---|
| Part Status | Active |
| Type | BGA |
| Number of Positions | 54 |
| Pitch | 0.047" (1.20mm) |
| Outer Dimension | 0.900" L x 1.300" W (22.86mm x 33.02mm) |
| Inner Dimension | - |
| Thermal Center Pad | - |
| Material | Stainless Steel |
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