maxim integrated has developed and marketed over 5,000 ics since 1983-more than any other analog semiconductor company in that time.
| Numéro d'article | DS34S132GNA2+ |
|---|---|
| État de la pièce | Active |
| Fonction | TDM-over-Packet (TDMoP) |
| Interface | TDMoP |
| Nombre de circuits | 1 |
| Tension - Alimentation | 1.8V, 3.3V |
| Offre actuelle | - |
| Puissance (Watts) | - |
| Température de fonctionnement | -40°C ~ 85°C |
| Type de montage | Surface Mount |
| Paquet / cas | 676-BGA |
| Package de périphérique fournisseur | 676-PBGA (27x27) |
Fabricant: Maxim Integrated
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La description: IC TDM/PACKET TRANSPORT
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La description: IC TRANSPORT TDM 484BGA
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La description: KIT EVAL DS34S132
En stock: 0
