the bergquist company is the world’s leading developer and manufacturer of thermal management materials which include sil-pad®, thermally conductive insulators and various specialty materials; gap pad®, gap filling materials, hi-flow®, phase change materials, softface® and bond-ply®.
| Numero di parte | CPU 1.375X1.375 |
|---|---|
| Stato parte | Obsolete |
| uso | CPU |
| Forma | Square |
| Contorno | 34.93mm x 34.93mm |
| Spessore | 0.0050" (0.127mm) |
| Materiale | - |
| Adesivo | - |
| Backing, Carrier | - |
| Colore | Tan |
| Resistività termica | - |
| Conduttività termica | 0.6 W/m-K |
fabbricante: Bergquist
Descrizione: THERM PAD CPU 1.375" X 1.375"
Disponibile: 0
