Numéro d'article | SMDSW.020 1OZ |
---|---|
État de la pièce | Active |
Type | Wire Solder |
Point de fusion | 361°F (183°C) |
Processus | Leaded |
Composition | Sn63Pb37 (63/37) |
Type de flux | No-Clean, Water Soluble |
Diamètre | 0.02" (0.51mm) |
Calibre du fil | 24 AWG, 25 SWG |
Taille du noyau | 0.022 |
Forme | Spool, 28g (1 oz) |
Durée de conservation | No Shelf Life |
Fabricant: Chip Quik Inc.
La description: SOLDER WIRE NO-CLEAN 63/37 1OZ.
En stock: 89
Fabricant: Chip Quik Inc.
La description: SOLDER WIRE NO-CLEAN 63/37 2OZ.
En stock: 75
Fabricant: Chip Quik Inc.
La description: SOLDER WIRE NO-CLEAN 63/37 4OZ.
En stock: 84
Fabricant: Chip Quik Inc.
La description: SOLDER WIRE NO-CLEAN 63/37 1OZ.
En stock: 74
Fabricant: Chip Quik Inc.
La description: SOLDER WIRE NO-CLEAN 63/37 2OZ.
En stock: 44
Fabricant: Chip Quik Inc.
La description: SOLDER WIRE NO-CLEAN 63/37 4OZ.
En stock: 82
Fabricant: Chip Quik Inc.
La description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
En stock: 201
Fabricant: Chip Quik Inc.
La description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
En stock: 46
Fabricant: Chip Quik Inc.
La description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
En stock: 225
Fabricant: Chip Quik Inc.
La description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
En stock: 128