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| Part Number | ICA-640-SGG |
|---|---|
| Part Status | Active |
| Type | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid) | 40 (2 x 20) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 30µin (0.76µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Open Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 30µin (0.76µm) |
| Contact Material - Post | Brass |
| Housing Material | Polyester, Glass Filled |
| Operating Temperature | -55°C ~ 125°C |
Manufacturer: Samtec Inc.
Description: CONN IC DIP SOCKET 8POS GOLD
In Stock: 0
Manufacturer: Samtec Inc.
Description: CONN IC DIP SOCKET 8POS GOLD
In Stock: 284
Manufacturer: Samtec Inc.
Description: CONN IC DIP SOCKET 8POS GOLD
In Stock: 0
Manufacturer: Samtec Inc.
Description: CONN IC DIP SOCKET 8POS GOLD
In Stock: 0
Manufacturer: Samtec Inc.
Description: CONN IC DIP SOCKET 8POS TIN
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Manufacturer: Samtec Inc.
Description: CONN IC DIP SOCKET 14POS GOLD
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Manufacturer: Samtec Inc.
Description: CONN IC DIP SOCKET 16POS GOLD
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