the bergquist company is the world’s leading developer and manufacturer of thermal management materials which include sil-pad®, thermally conductive insulators and various specialty materials; gap pad®, gap filling materials, hi-flow®, phase change materials, softface® and bond-ply®.
| 部品番号 | CPU .63X.63 |
|---|---|
| 部品ステータス | Obsolete |
| 使用法 | CPU |
| 形状 | Square |
| アウトライン | 16.00mm x 16.00mm |
| 厚さ | 0.0050" (0.127mm) |
| 材料 | - |
| 接着剤 | - |
| バッキング、キャリア | - |
| 色 | Tan |
| 熱抵抗 | - |
| 熱伝導率 | 0.6 W/m-K |
