the bergquist company is the world’s leading developer and manufacturer of thermal management materials which include sil-pad®, thermally conductive insulators and various specialty materials; gap pad®, gap filling materials, hi-flow®, phase change materials, softface® and bond-ply®.
| 부품 번호 | CPU .63X.63 |
|---|---|
| 부품 상태 | Obsolete |
| 용법 | CPU |
| 모양 | Square |
| 개요 | 16.00mm x 16.00mm |
| 두께 | 0.0050" (0.127mm) |
| 자료 | - |
| 점착제 | - |
| 배킹, 캐리어 | - |
| 색깔 | Tan |
| 열 저항 | - |
| 열 전도성 | 0.6 W/m-K |
