the bergquist company is the world’s leading developer and manufacturer of thermal management materials which include sil-pad®, thermally conductive insulators and various specialty materials; gap pad®, gap filling materials, hi-flow®, phase change materials, softface® and bond-ply®.
| Part Number | CPU .63X.63 |
|---|---|
| Part Status | Obsolete |
| Usage | CPU |
| Shape | Square |
| Outline | 16.00mm x 16.00mm |
| Thickness | 0.0050" (0.127mm) |
| Material | - |
| Adhesive | - |
| Backing, Carrier | - |
| Color | Tan |
| Thermal Resistivity | - |
| Thermal Conductivity | 0.6 W/m-K |
