the bergquist company is the world’s leading developer and manufacturer of thermal management materials which include sil-pad®, thermally conductive insulators and various specialty materials; gap pad®, gap filling materials, hi-flow®, phase change materials, softface® and bond-ply®.
| 部品番号 | HF115AC-0.0055-AC-105 |
|---|---|
| 部品ステータス | Active |
| 使用法 | SIP |
| 形状 | Rectangle |
| アウトライン | 36.83mm x 21.29mm |
| 厚さ | 0.0055" (0.140mm) |
| 材料 | Phase Change Compound |
| 接着剤 | Adhesive - One Side |
| バッキング、キャリア | Fiberglass |
| 色 | Gray |
| 熱抵抗 | 0.35°C/W |
| 熱伝導率 | 0.8 W/m-K |
