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제조사: Molex, LLC
기술: 2.0 I/O HOLD FAST TERM
재고: 0
기술: 1X4 EMI GUIDE HOUSING ASSY
기술: 1X1 EMI GUIDE HOUSING ASSY
기술: 1X2 EMI GUIDE HOUSING ASSY
기술: 1X4 EMI HOUSING ASSY 1 DEGREE
기술: 1X2 EMI HOUSING ASSY 1 DEGREE
기술: 1X1 EMI HOUSING ASSY 1 DEGREE
기술: 1X4EMI HOUSING ASSY 1 DEGREE
기술: 1X4 EMI HOUSING ASSY 0 DEGREE
기술: 1X1 EMI HOUSING ASSY 0 DEGREE
기술: 1X2 EMI HOUSING ASSY SAS 0
기술: 1X2 EMI HOUSING ASSY 0 DEGREE
기술: 1X1 SFP LT PIPE CVR ASY SIDE-TOP
기술: FEED TO COVER FOR SATA POWER
기술: FEED THROUGH TYPE COVER FOR SATA
기술: 2.0 I/O MOLD LOWER COVER 22CKT
기술: 2.0 I/O MOLD UPPER CVR STR 22CKT
기술: SFP ADPTR ASY LPBCK W/SER
기술: HOUSING FOR EXTERNAL SATA PLUG S
제조사: Pulse Electronics Network
기술: CONN XFP CAGE CLIP
기술: CONN XFP CAGE HEATSINK 1.7MM
기술: CONN XFP CAGE HEATSINK 11.0MM
제조사: Molex Connector Corporation
기술: CONN SFP+ LOOPBCK ADAPTER UNIVER
기술: 2.0 I/O CRIMP TERM CHAIN W/PLT
기술: 2.0 I/O CRIMP TERM LOOSE W/PLT
기술: 2.0 I/O SHELL BODY W/PLT 6CKT
기술: 2.0 I/O PLUG SHELL BODY
제조사: TE Connectivity AMP Connectors
기술: MICROQSFP EMI PLUG ASSEMBLY
기술: SFP 1X6 LIGHT PIPE ASSY, LOW PRO
기술: 100G CFP BACKER PLATE, NO CLIPS
기술: HEATSINK SFP ROUND PIN FIN
기술: XFP. MSA HEATSINK 13.5 W/O PINS
기술: XPAK RAIL ASSEMBLY
