chip quik®, inc. is the manufacturer of the new patented chip quik® smd removal kit. this innovative method of removing smd's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
제조사: Chip Quik Inc.
기술: SOLDER PASTE NO-CLEAN SAC305 T3
재고: 2
기술: SOLDER SPHERES SN63/PB37 .012" D
재고: 19
기술: SOLDER SPHERES SN63/PB37 .030" D
기술: SOLDER PASTE TWO PART MIX
재고: 17
기술: SOLDER PASTE SAC305 250G T3
재고: 169
기술: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
재고: 162
기술: SOLDER PASTE SN63/PB37 250G T5
재고: 16
기술: SOLDER SPHERES SAC305 DIAMETER 2
재고: 15
기술: SOLDER SPHERES SAC305 .024" DIAM
기술: SOLDER SPHERES SAC305 .030" DIAM
기술: SLDR PST NO-CLEAN SAC305 T4 10CC
기술: SOLDER PASTE WATER SOL LF 10CC
재고: 149
재고: 14
기술: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
재고: 128
기술: SOLDER WIRE LOW TEMP 42/57/1 32'
재고: 104
기술: SOLDER PASTE LOW TEMP T4 250G
재고: 10
기술: SLDR PST NO-CLEAN SAC305 T4 250G
기술: SOLDER PASTE 63/37 T4 500G
재고: 0
기술: SOLDER SPHERES 63/37 .020 DIAM
기술: SOLDER PASTE 63/37 T3 500G
기술: SOLDER SPHERES 63/37 .030 DIAM
기술: SOLDER PASTE SN63/PB37 500G
기술: SOLDER PASTE SAC305 T5 500G
기술: SOLDER PASTE LOW TEMP T5 500G
기술: SOLDER PASTE SAC305 500G T5
기술: SOLDER PASTE 63/37 T5 500G
기술: SOLDER PASTE SN63/PB37 500G T5
기술: SOLDER PASTE LOW TEMP T4 500G
기술: SOLDER PASTE SN42/BI58 500G
기술: SOLDER PASTE SAC305 T4 500G
기술: SOLDER SPHERES SAC305 .020 DIAM
기술: SOLDER SPHERES SAC305 .024 DIAM
기술: SOLDER SPHERES SAC305 .025 DIAM
기술: SOLDER SPHERES SAC305 .030 DIAM
기술: SOLDER PASTE SAC305 T3 500G
기술: SOLDER SPHERES 63/37 .012 DIAM
기술: SOLDER PASTE SAC305 500G
