chip quik®, inc. is the manufacturer of the new patented chip quik® smd removal kit. this innovative method of removing smd's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
제조사: Chip Quik Inc.
기술: STENCIL QFN-20 .5MM
재고: 8
기술: STENCIL LGA-16 .5MM
재고: 7
기술: SOIC-8 STENCIL
기술: STENCIL LQFP-48 .5MM
재고: 6
기술: STENCIL TSSOP-16 .65MM
기술: STENCIL BGA-324 .8MM
재고: 5
기술: STENCIL 5X5 MM .5MM
기술: STENCIL BGA-100 1.27MM
재고: 4
기술: STENCIL SSOP-28 .65MM
기술: QFN-48 STENCIL
재고: 27
기술: STENCIL 4X4MM .5MM
재고: 21
기술: STENCIL BGA-100 .8MM
재고: 2
기술: STENCIL BGA-484 1.27MM
기술: STENCIL BGA-100 1MM
기술: STENCIL TQFP-32 .8MM
기술: QFN-40 STENCIL
재고: 18
기술: STENCIL TQFP-80 .5MM
재고: 13
기술: STENCIL TQFP-144 .5MM
기술: STENCIL LQFP-44 .8MM
재고: 12
기술: STENCIL VQFP-64 .5MM
재고: 10
기술: STENCIL BGA-484 1MM
재고: 1
기술: MSOP-12 (0.65MM PITCH, 4X3MM BOD
기술: STENCIL MSOP-10
기술: STENCIL LGA-14 3X5MM .8MM
기술: BGA-54 (1.2MM PITCH) STENCIL
재고: 0
기술: BGA-100 (0.65MM PITCH) STENCIL
기술: BGA-25 (0.4MM PITCH) STENCIL
기술: BGA-25 STENCIL
기술: BGA-42 STENCIL
기술: BGA-54 STENCIL
기술: SOIC-32 (1.27MM PITCH, 20.4X11.3
기술: DFN-8 (0.45MM PITCH, 2X3MM BODY)
기술: SON-6 (0.65MM PITCH, 2X2MM BODY)
기술: SOP-36 (0.65MM PITCH, 12.8X7.5MM
기술: POWERPAD-16/POWERSOIC-16 (1.27MM
기술: SOIC-44 (1.27MM PITCH, 28.1X13.2
기술: BGA-24 (1MM PITCH, 8X6MM BODY) S
기술: BGA-25 (1MM PITCH, 8X6MM BODY) S
기술: DFN-8/MLP-8 (1.27MM PITCH, 6X8MM
기술: DFN-8/MOS-8 (0.97MM PITCH, 3.94X
기술: QFN-16/LFCSP-16 (0.5MM PITCH, 4X
기술: QFN-20/LFCSP-20 (0.5MM PITCH, 4X
기술: DFN-12 (0.5MM PITCH, 3X3MM BODY)
기술: TSSOP-48 (LONG PINS) (0.5MM PITC
기술: TSSOP-56 (LONG PINS) (0.5MM PITC
기술: TSSOP-64 (LONG PINS) (0.5MM PITC
기술: QFN-14/LFCSP-14 (0.5MM PITCH, 3X
기술: QFN-12/LFCSP-12 (0.4MM PITCH, 2X
기술: LGA-10 (0.4MM PITCH, 1.55X1.15MM
기술: POWERPAD-20/POWERSOIC-20 (1.27MM