chip quik®, inc. is the manufacturer of the new patented chip quik® smd removal kit. this innovative method of removing smd's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
제조사: Chip Quik Inc.
기술: SOLDER PASTE SN63/PB37 250G T5
재고: 14
기술: STENCIL TQFP-80 .5MM
재고: 13
기술: STENCIL TQFP-144 .5MM
기술: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
재고: 128
기술: STENCIL LQFP-44 .8MM
재고: 12
기술: SOLDER WIRE LOW TEMP 42/57/1 32'
재고: 104
기술: SOLDER PASTE LOW TEMP T4 250G
재고: 10
기술: SLDR PST NO-CLEAN SAC305 T4 250G
기술: INDUSTRIAL DISP TIP KIT
기술: STENCIL VQFP-64 .5MM
기술: STENCIL BGA-484 1MM
재고: 1
기술: MSOP-12 (0.65MM PITCH, 4X3MM BOD
기술: STENCIL MSOP-10
기술: STENCIL LGA-14 3X5MM .8MM
기술: SYRINGE GUN MANUAL 10CC
재고: 0
기술: SOLDER PASTE 63/37 T4 500G
기술: SOLDER SPHERES 63/37 .020 DIAM
기술: SOLDER PASTE 63/37 T3 500G
기술: SOLDER SPHERES 63/37 .030 DIAM
기술: SOLDER PASTE SN63/PB37 500G
기술: BGA-54 (1.2MM PITCH) STENCIL
기술: BGA-100 (0.65MM PITCH) STENCIL
기술: BGA-25 (0.4MM PITCH) STENCIL
기술: SOLDER PASTE SAC305 T5 500G
기술: SOLDER PASTE LOW TEMP T5 500G
기술: BGA-25 STENCIL
기술: BGA-42 STENCIL
기술: BGA-54 STENCIL
기술: SOLDER PASTE SAC305 500G T5
기술: SOLDER PASTE 63/37 T5 500G
기술: SOLDER PASTE SN63/PB37 500G T5
기술: SOLDER PASTE LOW TEMP T4 500G
기술: SOLDER PASTE SN42/BI58 500G
기술: SOLDER PASTE SAC305 T4 500G
기술: SOLDER SPHERES SAC305 .020 DIAM
기술: SOIC-32 (1.27MM PITCH, 20.4X11.3
기술: DFN-8 (0.45MM PITCH, 2X3MM BODY)
기술: SON-6 (0.65MM PITCH, 2X2MM BODY)
기술: SOP-36 (0.65MM PITCH, 12.8X7.5MM
기술: POWERPAD-16/POWERSOIC-16 (1.27MM
기술: SOIC-44 (1.27MM PITCH, 28.1X13.2
기술: BGA-24 (1MM PITCH, 8X6MM BODY) S
기술: BGA-25 (1MM PITCH, 8X6MM BODY) S
기술: DFN-8/MLP-8 (1.27MM PITCH, 6X8MM
기술: DFN-8/MOS-8 (0.97MM PITCH, 3.94X
기술: QFN-16/LFCSP-16 (0.5MM PITCH, 4X
