chip quik®, inc. is the manufacturer of the new patented chip quik® smd removal kit. this innovative method of removing smd's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
제조사: Chip Quik Inc.
기술: QFN-44 STENCIL
재고: 0
기술: TSSOP-28-EXP-PAD STENCIL
기술: LGA-16 STENCIL
기술: SOIC-20 STENCIL
기술: SOIC-24 STENCIL
기술: POWERSOIC-8/PSOP-8/HSOP-8 STENCI
기술: QFN-20 0.5 MM PITCH 4.0 X 4.0 MM
기술: QFN-20 STENCIL
기술: QFN-36 STENCIL
기술: QFN-48 STENCIL
기술: SSOP-20 STENCIL
기술: PLCC-28/LCC-28/JLCC-28 STENCIL
기술: QFN-16 STENCIL
기술: QFN-28 STENCIL
기술: QFN-40 STENCIL
기술: QFN-68 STENCIL
기술: SOIC-14 STENCIL
기술: PLCC-32 STENCIL
기술: QFN-56 STENCIL
기술: SOT23/TO-236 STENCIL
기술: TSSOP-24 STENCIL
기술: VSSOP-8 STENCIL
기술: SSOP-16 STENCIL
기술: SSOP-24 STENCIL
기술: TQFP-32 STENCIL
기술: TSSOP-48 STENCIL
기술: PLCC-20/LCC-20/JLCC-20 STENCIL
기술: QFN-24-THIN STENCIL
기술: QFN-38 STENCIL
기술: SSOP-48 STENCIL
기술: TQFP-64/QFP-64 STENCIL
기술: TSSOP-8 STENCIL
기술: DFN-14 STENCIL
기술: QFP-208/QFP-208/RQFP-208 STENCI
기술: DFN-10 STENCIL
기술: DFN-8 STENCIL
기술: LGA-8 STENCIL
기술: MSOP-16 STENCIL
기술: QFN-16-THIN STENCIL
기술: QFN-32 STENCIL
기술: SC70-6/SOT-363 STENCIL
기술: SOIC-18 STENCIL
