the bergquist company is the world’s leading developer and manufacturer of thermal management materials which include sil-pad®, thermally conductive insulators and various specialty materials; gap pad®, gap filling materials, hi-flow®, phase change materials, softface® and bond-ply®.
| Artikelnummer | CPU .63X.63 |
|---|---|
| Teilstatus | Obsolete |
| Verwendung | CPU |
| Gestalten | Square |
| Gliederung | 16.00mm x 16.00mm |
| Dicke | 0.0050" (0.127mm) |
| Material | - |
| Klebstoff | - |
| Unterstützung, Träger | - |
| Farbe | Tan |
| Thermischer Widerstand | - |
| Wärmeleitfähigkeit | 0.6 W/m-K |
