the bergquist company is the world’s leading developer and manufacturer of thermal management materials which include sil-pad®, thermally conductive insulators and various specialty materials; gap pad®, gap filling materials, hi-flow®, phase change materials, softface® and bond-ply®.
| Numéro d'article | CPU .63X.63 |
|---|---|
| État de la pièce | Obsolete |
| Usage | CPU |
| Forme | Square |
| Contour | 16.00mm x 16.00mm |
| Épaisseur | 0.0050" (0.127mm) |
| Matériel | - |
| Adhésif | - |
| Support, transporteur | - |
| Couleur | Tan |
| Résistivité thermique | - |
| Conductivité thermique | 0.6 W/m-K |
