the bergquist company is the world’s leading developer and manufacturer of thermal management materials which include sil-pad®, thermally conductive insulators and various specialty materials; gap pad®, gap filling materials, hi-flow®, phase change materials, softface® and bond-ply®.
| Osa numero | CPU .63X.63 |
|---|---|
| Osan tila | Obsolete |
| Käyttö | CPU |
| Muoto | Square |
| ääriviivat | 16.00mm x 16.00mm |
| Paksuus | 0.0050" (0.127mm) |
| materiaali | - |
| tarttuva | - |
| Taaksepäin, Carrier | - |
| Väri | Tan |
| Lämpöresistanssi | - |
| Lämmönjohtokyky | 0.6 W/m-K |
