the bergquist company is the world’s leading developer and manufacturer of thermal management materials which include sil-pad®, thermally conductive insulators and various specialty materials; gap pad®, gap filling materials, hi-flow®, phase change materials, softface® and bond-ply®.
| Numero de parte | CPU .63X.63 |
|---|---|
| Estado de la pieza | Obsolete |
| Uso | CPU |
| Forma | Square |
| contorno | 16.00mm x 16.00mm |
| Espesor | 0.0050" (0.127mm) |
| Material | - |
| Adhesivo | - |
| Backing, Carrier | - |
| Color | Tan |
| Resistencia térmica | - |
| Conductividad térmica | 0.6 W/m-K |
